Handbook Of Tape Automated Bonding

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Tape Automated Bonding (TAB), a technology now favoured by the Japanese, is necessary for fine-pitch technology (tomorrow’s computers), high-volume manufacture, and multi-chip modules (the packaging industry’s answer to the high cost and complexity of electronics packages). All these technologies are now emerging but rapidly growing. TAB is a forerunner for serious growth; however, conversion to TAB is costly and requires changes in current manufacturing practices. Designed to help managers and engineers make the conversion successfully, this book covers the basics from selection, cost and benefits through to implementation issues. This book should be of interest to design, manufacturing, reliability, technical, materials, processing and test engineers, and project managers.