Search results for ‘John H. Lau’

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      Cover image for Heterogeneous Integrations
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      Heterogeneous Integrations

      John H Lau

      $424.99

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      Solder Joint Reliability: Theory and Applications

      John H. Lau

      New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

      $538.99

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      Fan-Out Wafer-Level Packaging

      John H. Lau

      This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

      $353.99

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      Heterogeneous Integrations

      John H. Lau

      This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D)…

      $384.99

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      Cover image for Solder Joint Reliability: Theory and Applications
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      Solder Joint Reliability: Theory and Applications

      John H. Lau

      New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

      $538.99

      Available to order, ships in 7-14 daysAvailable to order

      Cover image for Handbook Of Tape Automated Bonding
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      Handbook Of Tape Automated Bonding

      John H. Lau

      Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in…

      $538.99

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      Cover image for Chip On Board: Technology for Multichip Modules
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      Chip On Board: Technology for Multichip Modules

      John H. Lau

      A guide to the COB technology. It is suitable for professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and…

      $538.99

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      Cover image for Fan-Out Wafer-Level Packaging
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      Fan-Out Wafer-Level Packaging

      John H. Lau

      This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

      $389.99

      Available to order, ships in approx 4 weeksAvailable to order

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      Semiconductor Advanced Packaging

      John H. Lau

      The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed…

      $276.99

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      Semiconductor Advanced Packaging

      John H. Lau

      The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed…

      $400.99

      Available to order, ships in 7-14 daysAvailable to order

      Cover image for Assembly and Reliability of Lead-Free Solder Joints
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      Assembly and Reliability of Lead-Free Solder Joints

      John H. Lau,Ning-Cheng Lee

      This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved…

      $637.99

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      Assembly and Reliability of Lead-Free Solder Joints

      John H. Lau,Ning-Cheng Lee

      This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved…

      $459.99

      Available to order, ships in approx 4 weeksAvailable to order

      Cover image for Mechanics of Solder Alloy Interconnects
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      Mechanics of Solder Alloy Interconnects

      Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau

      The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. With this gained understanding, the reader in search of a solution…

      $538.99

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      Building Leadership Bridges Book Set (2015-2019)

      This book set includes all 8 titles in the Building Leadership Bridges series, published between 2015-2019. Published in conjunction with the ILA, these titles bridge the gap between research and…

      $1039.99

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