Artificial Intelligence and Computational Intelligence: International Conference, AICI 2009, Shanghai, China, November 7-8, 2009, Proceedings

Artificial Intelligence and Computational Intelligence: International Conference, AICI 2009, Shanghai, China, November 7-8, 2009, Proceedings
Format
Paperback
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Country
Germany
Published
26 October 2009
Pages
737
ISBN
9783642052521

Artificial Intelligence and Computational Intelligence: International Conference, AICI 2009, Shanghai, China, November 7-8, 2009, Proceedings

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The 2009 International Conference on Artificial Intelligence and Computational Int- ligence (AICI 2009) was held during November 7-8, 2009 in Shanghai, China. The technical program of the conference reflects the tremendous growth in the fields of artificial intelligence and computational intelligence with contributions from a large number of participants around the world. AICI 2009 received 1,203 submissions from 20 countries and regions. After rig- ous reviews, 79 high-quality papers were selected for this volume, representing an acceptance rate of 6.6%. These selected papers cover many new developments and their applications in the fields of artificial intelligence and computational intelligence. Their publications reflect a sustainable interest from the wide academic community worldwide in tirelessly pursuing new solutions through effective utilizations of arti- cial intelligence and computational intelligence to real-world problems. We would like to specially thank all the committee members and reviewers, without whose timely help it would have been impossible to review all the submitted papers to assemble this program. We also would like take this opportunity to express our heartfelt appreciation for all those who worked together in organizing this conference, establi- ing the technical programs and running the conference meetings. We greatly appreciate the authors, speakers, invited session organizers, session Chairs, and others who made this conference possible. Lastly, we would like to express our gratitude to the Shanghai University of Electric Power for the sponsorship and support of the conference.

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