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Bonding by Self-Propagating Reaction
Paperback

Bonding by Self-Propagating Reaction

$237.99
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This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.

Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and microsystems applications. The technique leads to high bonding strengths and low rates of damage on substrates. Another advantage is that it does not require high processing temperatures. The book is based on 251 original resources and includes their direct web link for in-depth reading.

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MORE INFO
Format
Paperback
Publisher
Materials Research Forum LLC
Date
15 March 2019
Pages
146
ISBN
9781644900086

This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.

Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and microsystems applications. The technique leads to high bonding strengths and low rates of damage on substrates. Another advantage is that it does not require high processing temperatures. The book is based on 251 original resources and includes their direct web link for in-depth reading.

Format
Paperback
Publisher
Materials Research Forum LLC
Date
15 March 2019
Pages
146
ISBN
9781644900086