Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R)
Erdogan Madenci,Ibrahim Guven,Bahattin Kilic
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys ®
Erdogan Madenci,Ibrahim Guven,Bahattin Kilic
This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS ® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS ® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS ® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS ® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
This item is not currently in-stock. It can be ordered online and is expected to ship in 7-14 days
Our stock data is updated periodically, and availability may change throughout the day for in-demand items. Please call the relevant shop for the most current stock information. Prices are subject to change without notice.
Sign in or become a Readings Member to add this title to a wishlist.