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Circuit and Interconnect Design for RF and High Bit-rate Applications
Hardback

Circuit and Interconnect Design for RF and High Bit-rate Applications

$407.99
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This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.

Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the ‘interconnect’) and circuit design. This detailed book covers each of these topics from theory to practice, with sufficient detail to help you produce circuits that are ‘first-time right’. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.

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MORE INFO
Format
Hardback
Publisher
Springer-Verlag New York Inc.
Country
United States
Date
3 July 2008
Pages
246
ISBN
9781402068829

This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.

Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the ‘interconnect’) and circuit design. This detailed book covers each of these topics from theory to practice, with sufficient detail to help you produce circuits that are ‘first-time right’. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.

Read More
Format
Hardback
Publisher
Springer-Verlag New York Inc.
Country
United States
Date
3 July 2008
Pages
246
ISBN
9781402068829