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Home / Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
 
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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

ASME
$1230.99
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Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:

Autonomous, Hybrid, and Electric Vehicles Energy Conversion and Storage Flexible and Wearable Electronics Heterogeneous Integration Internet of Things Photonics and Optics Power Electronics Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions and Service to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Cooling of Server Systems

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MORE INFO
Format
Paperback
Publisher
American Society of Mechanical Engineers,U.S.
Country
United States
Date
30 June 2020
Pages
836
ISBN
9780791859322

Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:

Autonomous, Hybrid, and Electric Vehicles Energy Conversion and Storage Flexible and Wearable Electronics Heterogeneous Integration Internet of Things Photonics and Optics Power Electronics Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions and Service to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Cooling of Server Systems

Read More
Format
Paperback
Publisher
American Society of Mechanical Engineers,U.S.
Country
United States
Date
30 June 2020
Pages
836
ISBN
9780791859322

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