LED Packaging for Lighting Applications: Design, Manufacturing, and Testing

Helps practitioners significantly shorten the time for design, manufacturing, and testing of LED packaging In LED Packaging and Applications, Liu and Luo introduce key LED packaging technologies: optical design, mechanical and thermal management, and reliability issues, along with introductions of several practical applications. Liu and Luo start by familiarizing readers with LED device physics and sample applications. The authors then cover the optical properties of LED output light, and how to manipulate and optimize emission characteristics. Liu and Luo then detail thermal management of LED packaging – a critical issue in high power LED and solid-state lighting applications, along with reliability issues in LED packaging. Many concepts in design and processes in manufacturing and testing are proposed for the first time, and concepts are presented with a co-design approach to minimize the time to market for LED products.* One of the only books to cover LEDs from package design to manufacturing to testing* Contains real-world examples for practitioners to understand the concepts quickly* Covers the steps needed to transform an LED chip into a competitive lighting product* Includes in-depth discussion of reliability issues* Presents the state of the art in LED packaging research* Codes and demonstrations available from the book’s Companion Website