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This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.
This practical guide seeks to provide a comprehensive overview of the fundamentals of design, fabrication and assembly of electronic equipment packages with the focus on competitive, stable product development. Its easy-to-use tutorial format keeps theory to a minimum. The first part addresses basic package elements and surveys the most significant new technologies in this rapidly growing field. Part Two deals with the design, materials selection, and process implementation for low-cost, high-performance packaging. It shows how modern packaging technology relates to final product performance, and helps readers master value analysis, testing, and life-cycle costing. A chapter on system integration brings the electronics package into the full system of both consumer and military products. This book should be of interest to electronics engineers and mechanical engineers working in the design and fabrication of electronics packages; engineers and managers involved in cost management and product development.
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This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.
This practical guide seeks to provide a comprehensive overview of the fundamentals of design, fabrication and assembly of electronic equipment packages with the focus on competitive, stable product development. Its easy-to-use tutorial format keeps theory to a minimum. The first part addresses basic package elements and surveys the most significant new technologies in this rapidly growing field. Part Two deals with the design, materials selection, and process implementation for low-cost, high-performance packaging. It shows how modern packaging technology relates to final product performance, and helps readers master value analysis, testing, and life-cycle costing. A chapter on system integration brings the electronics package into the full system of both consumer and military products. This book should be of interest to electronics engineers and mechanical engineers working in the design and fabrication of electronics packages; engineers and managers involved in cost management and product development.