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Book

Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

$1807.99
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A threer-volume set updating the author’s earlier one-volume Microelectronics Handbook published in 1988. Revised to incorporate advances in the industry, this text provides a balance of theory and practical applications. The set explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

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MORE INFO
Format
Book
Publisher
Chapman and Hall
Country
United Kingdom
Date
31 January 1997
Pages
3000
ISBN
9780412084614

A threer-volume set updating the author’s earlier one-volume Microelectronics Handbook published in 1988. Revised to incorporate advances in the industry, this text provides a balance of theory and practical applications. The set explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

Read More
Format
Book
Publisher
Chapman and Hall
Country
United Kingdom
Date
31 January 1997
Pages
3000
ISBN
9780412084614