Encapsulation Technologies for Electronic Applications
Haleh Ardebili (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University),Jiawei Zhang (Staff Engineer, Qualcomm, San Diego, CA, USA),Michael Pecht (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA)
Encapsulation Technologies for Electronic Applications
Haleh Ardebili (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University),Jiawei Zhang (Staff Engineer, Qualcomm, San Diego, CA, USA),Michael Pecht (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA)
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