Three-dimensional Integrated Circuit Design

7 ½ X 9 ¼ in Chapter 1. Introduction

1.1. From the Integrated Circui t to the Computer

1.2. Interconnects; an old Friend

1.3. Three-Dimensional or Vertical Integration

1.3.1. Opportunities for Three-Dimensional Integration

1.3.2. Challenges for Three-Dimensional Integration

1.4. Book Organization
Chapter 2. Manufacturing of 3-D P ackaged Systems

2.1. Three-Dimensional Integration

2.1.1. System-in-Package

2.1.2. Three-Dimen sional Integrated Circuits

2.2. System-on-Package

2.3. Technologies for System-in-Package

2.3 .1. Wire Bonded System-in-Package

2.3.2. Peripheral Vert ical Interconnects

2.3.3. Area Array Vertical Interconn ects

2.3.4. Metallizing the Walls of an SiP

2.4. Cost Issues for 3-D Integrated Systems

2.5. S ummary
Chapter 3. 3-D Integrated Circuit Fabrication Techn ologies

3.1. Monolithic 3-D ICs

3.1.1.