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Add to list Added to list Encapsulation Technologies for Electronic Applications
Haleh Ardebili (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University),Jiawei Zhang (Staff Engineer, Qualcomm, San Diego, CA, USA),Michael Pecht (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA)
Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally…
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