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Add to list Added to list Electromigration in Metals: Fundamentals to Nano-Interconnects
Paul S. Ho (University of Texas, Austin),Chao-Kun Hu,Martin Gall,Valeriy Sukharev
Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable…
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