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      Cover image for System-in-Package: Electrical and Layout Perspectives
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      System-in-Package: Electrical and Layout Perspectives

      Lei He,Shauki Elassaad,Yiyu Shi,Yu Hu,Wei Yao

      Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and…

      $194.99

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