Search results for ‘Committee on Materials for High-Density Electronic Packaging,Commission on Engineering and Technical Systems,National Research Council’

Filter & Refine

      Cover image for Materials for High-Density Electronic Packaging and Interconnection
      Paperback
      Add to list Added to list

      Materials for High-Density Electronic Packaging and Interconnection

      Committee on Materials for High-Density Electronic Packaging,Commission on Engineering and Technical Systems,National Research Council

      $169.99

      Available to order, ships in approx 4 weeksAvailable to order