Materials for Information Technology: Devices, Interconnects and Packaging

Materials for Information Technology: Devices, Interconnects and Packaging
Format
Hardback
Publisher
Springer London Ltd
Country
United Kingdom
Published
1 September 2005
Pages
508
ISBN
9781852339418

Materials for Information Technology: Devices, Interconnects and Packaging

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The fast-developing information technology industry is driving a need for new materials to facilitate the development of more reliable microelectronic products. This book is an overview of current developments and R&D activities in the field of materials used for IT with a focus on future applications. Included are materials for: silicon-based semiconductor devices (including high-k gate dielectric materials); nonvolatile memories; on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and assembly and packaging.The latest results in materials science and engineering as well as applications in the semiconductor industry are covered, including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure, and microstructure. Computer modeling and analytical techniques to characterize thin film structures are also included for a comprehensive survey of materials for the IT industry.

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