Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

Er-Ping Li

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Format
Hardback
Publisher
John Wiley and Sons Ltd
Country
United States
Published
19 April 2012
Pages
384
ISBN
9780470623466

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

Er-Ping Li

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

This item is not currently in-stock. It can be ordered online and is expected to ship in approx 4 weeks

Our stock data is updated periodically, and availability may change throughout the day for in-demand items. Please call the relevant shop for the most current stock information. Prices are subject to change without notice.

Sign in or become a Readings Member to add this title to a wishlist.